YATO YT-82514 Vacuum Pick-Up Tool for SMD Soldering
Key information
Availability:Available from manufacturer — dispatch in 3 days
Shipping time:3 days
Shipping cost:From 3.29 Euro
catalog number:YT-82514
Availability:
EAN code:5906083075902
Product condition:New, originally packaged
Guarantee:24 months of consumer protection
Weight:0,04 kg
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- Product description
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YATO YT-82514 Vacuum Pick-Up Tool for SMD Soldering
A precision tool for handling electronic components during soldering work. The vacuum mechanism with three interchangeable silicone tips allows safe pick-up of SMD and BGA components weighing between 3 and 40 grams.
Features of the SMD vacuum pick-up tool
Push-button vacuum mechanism
The manually operated vacuum system gives you control over when a component is picked up and released. It removes the risk of accidentally dropping the part during precision soldering.
Three interchangeable silicone tips
Tips measuring 3, 6 and 10 mm in diameter suit different component sizes. The high-temperature-resistant silicone does not deform in the soldering zone, which keeps the grip stable when working with hot components.
Aluminium and stainless steel construction
The lightweight aluminium handle with PVC parts reduces hand fatigue during long jobs. The stainless steel needle stays straight and resists corrosion in workshop conditions.
15-gram weight
The low weight of the tool allows precise movement control when handling small components. The balance of the pick-up tool makes it easier to position parts on PCBs without hand tremor.
Technical specification
| Model | YT-82514 |
| Manufacturer | YATO |
| Overall length | 150 mm |
| Weight | 15 g |
| Needle material | Stainless steel |
| Suction tip material | Heat-resistant silicone |
| Handle material | Aluminium, PVC |
| Ø3 mm tip | Lifts components up to 3 g |
| Ø6 mm tip | Lifts components up to 18 g |
| Ø10 mm tip | Lifts components up to 40 g |
| Set contents | Pick-up tool + 3 suction tips |
Applications in electronics work
- Desoldering and fitting BGA (Ball Grid Array) packages on motherboards
- Handling SMD components when repairing smartphones and tablets
- Positioning resistors, capacitors and diodes on PCBs
- Replacing integrated circuits in electronic devices
- Transferring small components between the soldering station and the PCB
- Servicing computer and consumer electronics
- Prototyping electronic circuits with surface-mount components
- Repairing damaged tracks and solder joints
Choosing the right tip for the component type
Ø3 mm tip – components up to 3 g
SMD resistors and capacitors in 0402, 0603 and 0805 packages. Small LEDs, SOT-23 transistors, microprocessors in TQFP packages with a low pin count.
Ø6 mm tip – components up to 18 g
SMD electrolytic capacitors, ICs in SOIC, TSSOP and QFN packages. Pulse transformers, inductors, medium-sized surface-mount connectors.
Ø10 mm tip – components up to 40 g
BGA packages, processors in large packages, RAM modules, graphics controllers. Large connectors, card sockets, metal shields, heat sinks integrated with the package.
Use and maintenance
Before first use, check that the tip fits securely on the needle – a loose tip will not create sufficient vacuum. Hold the tool like a pen during use, as this gives the best control when positioning a component.
The vacuum mechanism is activated by pressing the button on the body. Holding the button down maintains the vacuum; releasing it lets the component go. When picking components off the surface of a board, avoid pressing too hard, as this could damage the PCB tracks.
After use, the silicone tips can be cleaned with isopropanol to remove flux residue. Check the steel needle periodically for dirt that could block the airflow. Storing the tool in a dry place prevents corrosion of the metal parts.
Commercial information
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