Lead-free solder 1 mm 250 g 76853 NO_NAME
Key information
Availability:In stock (ready to ship)
Shipping time:immediately
Shipping cost:From 3.29 Euro
catalog number:76853
Availability:
EAN code:5906083070310
Product condition:New, originally packaged
Guarantee:24 months of consumer protection
Weight:0,28 kg
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Lead-free solder 1 mm 250 g – Sn99.3Cu0.7 alloy
Lead-free soldering wire with a diameter of 1 mm in a 250 g pack, intended for soldering electronic components in accordance with the RoHS Directive. The tin-copper alloy ensures stable joints at a working temperature of 250-350°C.
Technical characteristics of the lead-free solder
Sn99.3Cu0.7 alloy compliant with RoHS
The lead-free composition eliminates toxic substances from the soldering process. The addition of 0.7% copper improves wettability and the mechanical strength of soldered joints, which is the standard in electronics compliant with environmental regulations.
1 mm diameter for precision work
The 1 mm diameter wire allows controlled dispensing of solder when soldering small SMD components, THT leads and solder joints on PCBs. Suitable for 30-80 W soldering irons.
Temperature range 250-350°C
The melting point of the Sn99.3Cu0.7 alloy is approximately 227°C. The recommended working range of 250-350°C ensures adequate solder fluidity and enough time to position components precisely without overheating the substrate.
PN EN 29453:2000 standard
Compliance with the European standard for fluxes and solders guarantees consistent quality and technical parameters. The standard defines the requirements for chemical composition, purity and soldering properties.
Technical specification
| Model | 76853 |
| Manufacturer | YATO |
| Wire diameter | 1 mm |
| Net weight | 250 g |
| Alloy composition | S-Sn99.3 Cu0.7 (99.3% tin, 0.7% copper) |
| Solder type | Lead-free |
| Recommended tip temperature | 250°C - 350°C |
| Standard | PN EN 29453:2000 |
| Directive compliance | RoHS 2002/95/EC |
Applications of the lead-free solder
- Soldering electronic components on printed circuit boards (PCBs)
- Assembly and repair of consumer electronics, household appliances and computer equipment
- Service work on RoHS-compliant consumer electronics
- Soldering SMD and THT components in prototyping
- Repair of electronic circuits in telecommunications
- Applications in automotive and industrial electronics
- Manual soldering with soldering stations
- Automated and semi-automated soldering processes
Use and operating parameters
Preparation for soldering
Before starting work, set the soldering iron temperature within the 250-350°C range. Lead-free solders require a higher temperature than the traditional Sn60Pb40 alloy (approximately 30-40°C more). The soldering iron tip should be clean and correctly tinned.
Soldering technique with the Sn99.3Cu0.7 alloy
The tin-copper alloy has slightly poorer wettability than leaded alloys, so the soldering time may be slightly longer. The parts to be joined should be heated adequately before the solder is applied. The joint should be bright and smooth – a matt surface may indicate insufficient heating.
Storing the solder
The solder should be stored in a dry place, protected from moisture and contamination. A 250 g pack is sufficient for several hundred typical electronic solder joints, depending on the size of the components being soldered.
Commercial information
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